By Professor Bram Hoex

Preprints

Ye Y; Ren J; Wang S; Wan Y; Razzak I; Hoex B; Wang H; Xie T; Zhang W, 2024, Construction and Application of Materials Knowledge Graph in Multidisciplinary Materials Science via Large Language Model, http://dx.doi.org/10.48550/arxiv.2404.03080

Ye Y; Zhou Y; Wang Y; Hoex B; Zhu X; Chen D; Xue W; Wei T; Chen B; Cheng M; Lu J; Yin H; Ouyang Z, 2024, Damp-Heat Stability Investigation of Glass-Backsheet Modules Based on Topcon Solar Cells, http://dx.doi.org/10.2139/ssrn.4986461

Madumelu C; Bowen F; Genhua J; Bao J; Seunghwan S; Chen R; Hallam B; Hoex B; Wright M, 2024, Impact of Oxide Thickness, Emitter Sheet Resistance, and Polysilicon Doping Concentration on the Passivation Quality and Long-Term Stability of Topcon Solar Cells, http://dx.doi.org/10.2139/ssrn.4685631

Xie T; Wan Y; Huang W; Yin Z; Liu Y; Wang S; Linghu Q; Kit C; Grazian C; Zhang W; Razzak I; Hoex B, 2023, DARWIN Series: Domain Specific Large Language Models for Natural Science, http://dx.doi.org/10.48550/arxiv.2308.13565

Xie T; Wan Y; Huang W; Zhou Y; Liu Y; Linghu Q; Wang S; Kit C; Grazian C; Zhang W; Hoex B, 2023, Large Language Models as Master Key: Unlocking the Secrets of Materials Science with GPT, http://dx.doi.org/10.48550/arxiv.2304.02213

Xie T; Wan Y; Zhou Y; Huang W; Liu Y; Linghu Q; Wang S; Kit C; Grazian C; Zhang W; Hoex B, 2023, Large Language Models as Master Key: Unlocking the Secrets of Materials Science, http://dx.doi.org/10.2139/ssrn.4534137

Rougieux F; Sen C; Abbott M; Hoex B, 2023, Light-Activated Surface Passivation for More Efficient Silicon Heterojunction Solar Cells: Origin, Physics and Stability, http://dx.doi.org/10.2139/ssrn.4653481

Xie T; Wan Y; Li W; Linghu Q; Wang S; Cai Y; Liu H; Kit C; Grazian C; Hoex B, 2022, Interdisciplinary Discovery of Nanomaterials Based on Convolutional Neural Networks, http://dx.doi.org/10.48550/arxiv.2212.02805

Madumelu C; Cai Y; Hollemann C; Peibst R; Hoex B; Hallam B; Soeriyadi A, Assessing the Stability of P+ and N+ Polysilicon Passivating Contacts with Various Capping Layers on P-Type Wafers, http://dx.doi.org/10.2139/ssrn.4289694

Sen C; Wang H; Wu X; Khan MU; Chan C; Abbott M; Hoex B, Four Failure Modes in Silicon Heterojunction Glass-Backsheet Modules, http://dx.doi.org/10.2139/ssrn.4293027

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