By Associate Professor Hoang-Phuong Phan

Journal articles

Nguyen T; Dinh T; Phan HP; Nguyen TK; Md Foisal AR; Nguyen NT; Dao DV, 2020, 'Opto-electronic coupling in semiconductors: Towards ultrasensitive pressure sensing', Journal of Materials Chemistry C, 8, pp. 4713 - 4721, http://dx.doi.org/10.1039/d0tc00229a

Dinh T; Nguyen T; Phan HP; Nguyen TK; Dau VT; Nguyen NT; Dao DV, 2020, 'Advances in Rational Design and Materials of High-Performance Stretchable Electromechanical Sensors', Small, 16, http://dx.doi.org/10.1002/smll.201905707

Nguyen TK; Phan HP; Dowling KM; Yalamarthy AS; Dinh T; Balakrishnan V; Liu T; Chapin CA; Truong QD; Dau VT; Goodson KE; Senesky DG; Dao DV; Nguyen NT, 2020, 'Lithography and Etching-Free Microfabrication of Silicon Carbide on Insulator Using Direct UV Laser Ablation', Advanced Engineering Materials, 22, http://dx.doi.org/10.1002/adem.201901173

Qamar A; Phan HP; Dinh T; Nguyen NT; Rais-Zadeh M, 2020, 'ScAlN/3C-SiC/Si platform for monolithic integration of highly sensitive piezoelectric and piezoresistive devices', Applied Physics Letters, 116, http://dx.doi.org/10.1063/5.0004943

Pham T; Nguyen T; Vadivelu RK; Dinh T; Qamar A; Yadav S; Yamauchi Y; Rogers JA; Nguyen N; Phan H, 2020, 'Stretchable Bioelectronics: A Versatile Sacrificial Layer for Transfer Printing of Wide Bandgap Materials for Implantable and Stretchable Bioelectronics (Adv. Funct. Mater. 43/2020)', Advanced Functional Materials, 30, http://dx.doi.org/10.1002/adfm.202070287

Balakrishnan V; Dinh T; Foisal ARM; Nguyen T; Phan HP; Dao DV; Nguyen NT, 2019, 'Paper-Based Electronics Using Graphite and Silver Nanoparticles for Respiration Monitoring', IEEE Sensors Journal, 19, pp. 11784 - 11790, http://dx.doi.org/10.1109/JSEN.2019.2939567

Fallahi H; Zhang J; Phan HP; Nguyen NT, 2019, 'Flexible microfluidics: Fundamentals, recent developments, and applications', Micromachines, 10, http://dx.doi.org/10.3390/mi10120830

Nguyen T; Dinh T; Foisal ARM; Phan HP; Nguyen TK; Nguyen NT; Dao DV, 2019, 'Giant piezoresistive effect by optoelectronic coupling in a heterojunction', Nature Communications, 10, http://dx.doi.org/10.1038/s41467-019-11965-5

Phan HP; Zhong Y; Nguyen TK; Park Y; Dinh T; Song E; Vadivelu RK; Masud MK; Li J; Shiddiky MJA; Dao D; Yamauchi Y; Rogers JA; Nguyen NT, 2019, 'Long-Lived, Transferred Crystalline Silicon Carbide Nanomembranes for Implantable Flexible Electronics', ACS Nano, 13, pp. 11572 - 11581, http://dx.doi.org/10.1021/acsnano.9b05168

Nguyen HQ; Moghadam HA; Dinh T; Phan HP; Nguyen TK; Han J; Dimitrijev S; Nguyen NT; Dao DV, 2019, 'Dependence of offset voltage in AlGaN/GaN van der Pauw devices under mechanical strain', Materials Letters, 244, pp. 66 - 69, http://dx.doi.org/10.1016/j.matlet.2019.02.050

Dinh T; Dau V; Tran CD; Nguyen TK; Phan HP; Nguyen NT; Dao DV, 2019, 'Polyacrylonitrile-carbon Nanotube-polyacrylonitrile: A Versatile Robust Platform for Flexible Multifunctional Electronic Devices in Medical Applications', Macromolecular Materials and Engineering, 304, http://dx.doi.org/10.1002/mame.201900014

Md Foisal AR; Dinh T; Nguyen VT; Tanner P; Phan HP; Nguyen TK; Haylock B; Streed EW; Lobino M; Dao DV, 2019, 'Self-Powered Broadband (UV-NIR) Photodetector Based on 3C-SiC/Si Heterojunction', IEEE Transactions on Electron Devices, 66, pp. 1804 - 1809, http://dx.doi.org/10.1109/TED.2019.2899742

Phan HP; Nguyen TK; Dinh T; Qamar A; Iacopi A; Lu J; Dao DV; Rais-Zadeh M; Nguyen NT, 2019, 'Wireless battery-free SiC sensors operating in harsh environments using resonant inductive coupling', IEEE Electron Device Letters, 40, pp. 609 - 612, http://dx.doi.org/10.1109/LED.2019.2899068

Boriachek K; Masud MK; Palma C; Phan HP; Yamauchi Y; Hossain MSA; Nguyen NT; Salomon C; Shiddiky MJA, 2019, 'Avoiding pre-isolation step in exosome analysis: Direct isolation and sensitive detection of exosomes using gold-loaded nanoporous ferric oxide nanozymes', Analytical Chemistry, 91, pp. 3827 - 3834, http://dx.doi.org/10.1021/acs.analchem.8b03619

Dinh T; Nguyen TK; Phan HP; Nguyen Q; Han J; Dimitrijev S; Nguyen NT; Dao DV, 2019, 'Thermoresistance of p-Type 4H–SiC Integrated MEMS Devices for High-Temperature Sensing', Advanced Engineering Materials, 21, http://dx.doi.org/10.1002/adem.201801049

Balakrishnan V; Dinh T; Nguyen T; Phan HP; Nguyen TK; Dao DV; Nguyen NT, 2019, 'A hot-film air flow sensor for elevated temperatures', Review of Scientific Instruments, 90, http://dx.doi.org/10.1063/1.5065420

Phan HP; Masud MK; Vadivelu RK; Dinh T; Nguyen TK; Ngo K; Dao DV; Shiddiky MJA; Hossain MSA; Yamauchi Y; Nguyen NT, 2019, 'Transparent crystalline cubic SiC-on-glass electrodes enable simultaneous electrochemistry and optical microscopy', Chemical Communications, 55, pp. 7978 - 7981, http://dx.doi.org/10.1039/c9cc03082d

Phan HP; Nguyen TK; Dinh T; Cheng HH; Mu F; Iacopi A; Hold L; Dao DV; Suga T; Senesky DG; Nguyen NT, 2018, 'Strain Effect in Highly-Doped n-Type 3C-SiC-on-Glass Substrate for Mechanical Sensors and Mobility Enhancement', Physica Status Solidi A Applications and Materials Science, 215, http://dx.doi.org/10.1002/pssa.201800288

Lenzini F; Janousek J; Thearle O; Villa M; Haylock B; Kasture S; Cui L; Phan HP; Dao DV; Yonezawa H; Lam PK; Huntington EH; Lobino M, 2018, 'Integrated photonic platform for quantum information with continuous variables', Science Advances, 4, http://dx.doi.org/10.1126/sciadv.aat9331

Dinh T; Phan HP; Kashaninejad N; Nguyen TK; Dao DV; Nguyen NT, 2018, 'An On-Chip SiC MEMS Device with Integrated Heating, Sensing, and Microfluidic Cooling Systems', Advanced Materials Interfaces, 5, http://dx.doi.org/10.1002/admi.201800764

Nguyen TK; Phan HP; Dinh T; Dowling KM; Foisal ARM; Senesky DG; Nguyen NT; Dao DV, 2018, 'Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures', Materials and Design, 156, pp. 441 - 445, http://dx.doi.org/10.1016/j.matdes.2018.07.014

Phan HP; Dowling KM; Nguyen TK; Dinh T; Senesky DG; Namazu T; Dao DV; Nguyen NT, 2018, 'Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure', Materials and Design, 156, pp. 16 - 21, http://dx.doi.org/10.1016/j.matdes.2018.06.031

Fastier-Wooller J; Dinh T; Dau VT; Phan HP; Yang F; Dao DV, 2018, 'Low-cost graphite on paper pressure sensor for a robot gripper with a trivial fabrication process', Sensors Switzerland, 18, http://dx.doi.org/10.3390/s18103300

Vatani A; Woodfield PL; Dinh T; Phan HP; Nguyen NT; Dao DV, 2018, 'Degraded boiling heat transfer from hotwire in ferrofluid due to particle deposition', Applied Thermal Engineering, 142, pp. 255 - 261, http://dx.doi.org/10.1016/j.applthermaleng.2018.06.064

Balakrishnan V; Dinh T; Phan HP; Dao DV; Nguyen NT, 2018, 'Highly sensitive 3C-SiC on glass based thermal flow sensor realized using MEMS technology', Sensors and Actuators A Physical, 279, pp. 293 - 305, http://dx.doi.org/10.1016/j.sna.2018.06.025

Md Foisal AR; Dinh T; Tanner P; Phan HP; Nguyen TK; Streed EW; Dao DV, 2018, 'Photoresponse of a Highly-Rectifying 3C-SiC/Si Heterostructure Under UV and Visible Illuminations', IEEE Electron Device Letters, 39, pp. 1219 - 1222, http://dx.doi.org/10.1109/LED.2018.2850757

Islam MN; Moriam S; Umer M; Phan HP; Salomon C; Kline R; Nguyen NT; Shiddiky MJA, 2018, 'Naked-eye and electrochemical detection of isothermally amplified HOTAIR long non-coding RNA', Analyst, 143, pp. 3021 - 3028, http://dx.doi.org/10.1039/c7an02109g

Nguyen TK; Phan HP; Dinh T; Toriyama T; Nakamura K; Foisal ARM; Nguyen NT; Dao DV, 2018, 'Isotropic piezoresistance of p-type 4H-SiC in (0001) plane', Applied Physics Letters, 113, http://dx.doi.org/10.1063/1.5037545

Balakrishnan V; Dinh T; Phan HP; Dao DV; Nguyen NT, 2018, 'A Generalized Analytical Model for Joule Heating of Segmented Wires', Journal of Heat Transfer, 140, http://dx.doi.org/10.1115/1.4038829

Dinh T; Nguyen TK; Phan HP; Fastier-Wooller J; Tran CD; Nguyen NT; Dao DV, 2018, 'Electrical Resistance of Carbon Nanotube Yarns under Compressive Transverse Pressure', IEEE Electron Device Letters, 39, pp. 584 - 587, http://dx.doi.org/10.1109/LED.2018.2806181

Dinh T; Phan HP; Nguyen TK; Balakrishnan V; Cheng HH; Hold L; Lacopi A; Nguyen NT; Dao DV, 2018, 'Unintentionally Doped Epitaxial 3C-SiC(111) Nanothin Film as Material for Highly Sensitive Thermal Sensors at High Temperatures', IEEE Electron Device Letters, 39, pp. 580 - 583, http://dx.doi.org/10.1109/LED.2018.2808329

Md Foisal AR; Phan HP; Dinh T; Nguyen TK; Nguyen NT; Dao DV, 2018, 'A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding', Rsc Advances, 8, pp. 15310 - 15314, http://dx.doi.org/10.1039/c8ra00734a

Phan HP; Dowling KM; Nguyen TK; Chapin CA; Dinh T; Miller RA; Han J; Iacopi A; Senesky DG; Dao DV; Nguyen NT, 2018, 'Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures', Rsc Advances, 8, pp. 29976 - 29979, http://dx.doi.org/10.1039/c8ra05797d

Nguyen TK; Phan HP; Dinh T; Md Foisal AR; Nguyen NT; Dao DV, 2018, 'High-temperature tolerance of the piezoresistive effect in p-4H-SiC for harsh environment sensing', Journal of Materials Chemistry C, 6, pp. 8613 - 8617, http://dx.doi.org/10.1039/c8tc03094d

Nguyen TK; Phan HP; Han J; Dinh T; Md Foisal AR; Dimitrijev S; Zhu Y; Nguyen NT; Dao DV, 2018, 'Highly sensitive p-Type 4H-SiC van der Pauw sensor', Rsc Advances, 8, pp. 3009 - 3013, http://dx.doi.org/10.1039/c7ra11922d

Phan HP; Nguyen TK; Dinh T; Iacopi A; Hold L; Shiddiky MJA; Dao DV; Nguyen NT, 2018, 'Robust Free-Standing Nano-Thin SiC Membranes Enable Direct Photolithography for MEMS Sensing Applications', Advanced Engineering Materials, 20, http://dx.doi.org/10.1002/adem.201700858

Phan H; Nguyen T; Dinh T; Cheng H; Mu F; Iacopi A; Hold L; Dao DV; Suga T; Senesky DG; Nguyen N, 2018, 'Strain Effect in Highly‐Doped n‐Type 3C‐SiC‐on‐Glass Substrate for Mechanical Sensors and Mobility Enhancement (Phys. Status Solidi A 24∕2018)', physica status solidi (a), 215, http://dx.doi.org/10.1002/pssa.201870054

Nguyen TK; Phan HP; Kamble H; Vadivelu R; Dinh T; Iacopi A; Walker G; Hold L; Nguyen NT; Dao DV, 2017, 'Superior Robust Ultrathin Single-Crystalline Silicon Carbide Membrane as a Versatile Platform for Biological Applications', ACS Applied Materials and Interfaces, 9, pp. 41641 - 41647, http://dx.doi.org/10.1021/acsami.7b15381

Tanner P; Iacopi A; Phan HP; Dimitrijev S; Hold L; Chaik K; Walker G; Dao DV; Nguyen NT, 2017, 'Excellent Rectifying Properties of the n-3C-SiC/p-Si Heterojunction Subjected to High Temperature Annealing for Electronics, MEMS, and LED Applications', Scientific Reports, 7, http://dx.doi.org/10.1038/s41598-017-17985-9

Md Foisal AR; Qamar A; Phan HP; Dinh T; Tuan KN; Tanner P; Streed EW; Dao DV, 2017, 'Pushing the Limits of Piezoresistive Effect by Optomechanical Coupling in 3C-SiC/Si Heterostructure', ACS Applied Materials and Interfaces, 9, pp. 39921 - 39925, http://dx.doi.org/10.1021/acsami.7b12128

Dinh T; Phan HP; Qamar A; Woodfield P; Nguyen NT; Dao DV, 2017, 'Thermoresistive Effect for Advanced Thermal Sensors: Fundamentals, Design Considerations, and Applications', Journal of Microelectromechanical Systems, 26, pp. 966 - 986, http://dx.doi.org/10.1109/JMEMS.2017.2710354

Balakrishnan V; Phan HP; Dinh T; Dao DV; Nguyen NT, 2017, 'Thermal flow sensors for harsh environments', Sensors Switzerland, 17, http://dx.doi.org/10.3390/s17092061

Fiondella L; Lin Y-K; Phan H; Chang P-C; Li C, 2017, 'A confidence-based approach to reliability design considering correlated failures', RELIABILITY ENGINEERING & SYSTEM SAFETY, 165, pp. 102 - 114, http://dx.doi.org/10.1016/j.ress.2017.03.025

Nguyen TK; Dinh T; Phan HP; Tran CD; Foisal ARM; Zhu Y; Dao DV, 2017, 'Electrically Stable Carbon Nanotube Yarn under Tensile Strain', IEEE Electron Device Letters, 38, pp. 1331 - 1334, http://dx.doi.org/10.1109/LED.2017.2726016

Phan HP; Cheng HH; Dinh T; Wood B; Nguyen TK; Mu F; Kamble H; Vadivelu R; Walker G; Hold L; Iacopi A; Haylock B; Dao DV; Lobino M; Suga T; Nguyen NT, 2017, 'Single-Crystalline 3C-SiC anodically Bonded onto Glass: An Excellent Platform for High-Temperature Electronics and Bioapplications', ACS Applied Materials and Interfaces, 9, pp. 27365 - 27371, http://dx.doi.org/10.1021/acsami.7b06661

Nguyen TK; Phan HP; Dinh T; Han J; Dimitrijev S; Tanner P; Foisal ARM; Zhu Y; Nguyen NT; Dao DV, 2017, 'Experimental investigation of piezoresistive effect in p-Type 4H-SiC', IEEE Electron Device Letters, 38, pp. 955 - 958, http://dx.doi.org/10.1109/LED.2017.2700402

Balakrishnan V; Dinh T; Phan HP; Kozeki T; Namazu T; Dao DV; Nguyen NT, 2017, 'Steady-state analytical model of suspended p-type 3C-SiC bridges under consideration of Joule heating', Journal of Micromechanics and Microengineering, 27, http://dx.doi.org/10.1088/1361-6439/aa7180

Phan HP; Ina G; Dinh T; Kozeki T; Nguyen TK; Namazu T; Qamar A; Dao DV; Nguyen NT, 2017, 'Formation of silicon carbide nanowire on insulator through direct wet oxidation', Materials Letters, 196, pp. 280 - 283, http://dx.doi.org/10.1016/j.matlet.2017.03.118

Dinh T; Phan HP; Nguyen TK; Qamar A; Woodfield P; Zhu Y; Nguyen NT; Viet Dao D, 2017, 'Solvent-free fabrication of biodegradable hot-film flow sensor for noninvasive respiratory monitoring', Journal of Physics D Applied Physics, 50, http://dx.doi.org/10.1088/1361-6463/aa6cd6

Lenzini F; Haylock B; Loredo JC; Abrahão RA; Zakaria NA; Kasture S; Sagnes I; Lemaitre A; Phan HP; Dao DV; Senellart P; Almeida MP; White AG; Lobino M, 2017, 'Active demultiplexing of single photons from a solid-state source', Laser and Photonics Reviews, 11, http://dx.doi.org/10.1002/lpor.201600297

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