By Professor Jang-Kyo Kim

Journal articles

Ding Y; Kim JK, 2008, 'Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise', Microelectronics Reliability, 48, pp. 149 - 157, http://dx.doi.org/10.1016/j.microrel.2007.01.083

Kim J-K; Zhou L; Huang HT; Wo DZ, 2008, 'ACCM-5 special issue (vol 39, pg 569, 2008)', COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 39, pp. 1071 - 1071, http://dx.doi.org/10.1016/j.compositesa.2008.04.006

Woo RSC; Chen Y; Zhu H; Li J; Kim JK; Leung CKY, 2007, 'Environmental degradation of epoxy-organoclay nanocomposites due to UV exposure. Part I: Photo-degradation', Composites Science and Technology, 67, pp. 3448 - 3456, http://dx.doi.org/10.1016/j.compscitech.2007.03.004

Li J; Ma PC; Chow WS; To CK; Tang BZ; Kim JK, 2007, 'Correlations between percolation threshold, dispersion state, and aspect ratio of carbon nanotubes', Advanced Functional Materials, 17, pp. 3207 - 3215, http://dx.doi.org/10.1002/adfm.200700065

Ma PC; Kim JK; Tang BZ, 2007, 'Effects of silane functionalization on the properties of carbon nanotube/epoxy nanocomposites', Composites Science and Technology, 67, pp. 2965 - 2972, http://dx.doi.org/10.1016/j.compscitech.2007.05.006

Li J; Kim JK, 2007, 'Percolation threshold of conducting polymer composites containing 3D randomly distributed graphite nanoplatelets', Composites Science and Technology, 67, pp. 2114 - 2120, http://dx.doi.org/10.1016/j.compscitech.2006.11.010

Siddiqui NA; Woo RSC; Kim JK; Leung CCK; Munir A, 2007, 'Corrigendum to "Mode I interlaminar fracture behaviour and mechanical properties of CFRPs with nanoclay-filled epoxy matrix" [Composites Part A 38 (2007) 449-460] (DOI:10.1016/j.compositesa.2006.03.001)', Composites Part A Applied Science and Manufacturing, 38, pp. 1810, http://dx.doi.org/10.1016/j.compositesa.2006.12.002

Sham ML; Kim JK; Park JH, 2007, 'Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin', Computational Materials Science, 40, pp. 81 - 89, http://dx.doi.org/10.1016/j.commatsci.2006.11.004

KIM J-K, 2007, 'IMPACT DAMAGE EVALUATION OF FIBRE-REINFORCED COMPOSITE MATERIALS AND STRUCTURES', International Conference on Aerospace Sciences and Aviation Technology, 12, pp. 1 - 12, http://dx.doi.org/10.21608/asat.2007.24387

Li J; Vaisman L; Marom G; Kim JK, 2007, 'Br treated graphite nanoplatelets for improved electrical conductivity of polymer composites', Carbon, 45, pp. 744 - 750, http://dx.doi.org/10.1016/j.carbon.2006.11.031

Gao B; Leung CKY; Kim JK, 2007, 'Failure diagrams of FRP strengthened RC beams', Composite Structures, 77, pp. 493 - 508, http://dx.doi.org/10.1016/j.compstruct.2005.08.003

Li J; Sham ML; Kim JK; Marom G, 2007, 'Morphology and properties of UV/ozone treated graphite nanoplatelet/epoxy nanocomposites', Composites Science and Technology, 67, pp. 296 - 305, http://dx.doi.org/10.1016/j.compscitech.2006.08.009

Siddiqui NA; Woo RSC; Kim JK; Leung CCK; Munir A, 2007, 'Mode I interlaminar fracture behavior and mechanical properties of CFRPs with nanoclay-filled epoxy matrix', Composites Part A Applied Science and Manufacturing, 38, pp. 449 - 460, http://dx.doi.org/10.1016/j.compositesa.2006.03.001

Kim J-K; Sham ML, 2007, 'Functionalization of carbon nanotube surface via UV/O₃ treatment', NANOSCIENCE AND TECHNOLOGY, PTS 1 AND 2, 121-123, pp. 1407 - 1410, http://dx.doi.org/10.4028/www.scientific.net/SSP.121-123.1407

Ma PC; Kim J-K; Tang BZ, 2007, 'Functionalization of multi-walled carbon nanotubes via UV/O₃ and silane treatments', ADVANCES IN COMPOSITE MATERIALS AND STRUCTURES, PTS 1 AND 2, 334-335, pp. 797 - +, http://dx.doi.org/10.4028/www.scientific.net/KEM.334-335.797

Siddiqui NA; Kim J-K; Muzaffar F; Munir A, 2007, 'Self-healing glass fibres with carbon nanotube-epoxy nanocomposite coating', ADVANCES IN COMPOSITE MATERIALS AND STRUCTURES, PTS 1 AND 2, 334-335, pp. 805 - +, http://dx.doi.org/10.4028/www.scientific.net/KEM.334-335.805

Zhu H; Woo RSC; Leung CKY; Kim J-K, 2007, 'Wear resistance of organic nanocomposites', ADVANCES IN COMPOSITE MATERIALS AND STRUCTURES, PTS 1 AND 2, 334-335, pp. 605 - +, http://dx.doi.org/10.4028/www.scientific.net/KEM.334-335.605

Ma PC; Kim JK; Tang BZ, 2006, 'Functionalization of carbon nanotubes using a silane coupling agent', Carbon, 44, pp. 3232 - 3238, http://dx.doi.org/10.1016/j.carbon.2006.06.032

Gao B; Kim JK; Leung CKY, 2006, 'Effect of tapered FRP sheets on interlaminar fracture behaviour of FRP-concrete interface', Composites Part A Applied Science and Manufacturing, 37, pp. 1605 - 1612, http://dx.doi.org/10.1016/j.compositesa.2005.10.010

Gao B; Kim JK; Leung CKY, 2006, 'Strengthening efficiency of taper ended FRP strips bonded to RC beams', Composites Science and Technology, 66, pp. 2257 - 2264, http://dx.doi.org/10.1016/j.compscitech.2005.12.002

Kim JK; Woo RSC; Hung PYP; Lebbai M, 2006, 'Adhesion performance of black oxide coated copper substrates: Effects of moisture sensitivity test', Surface and Coatings Technology, 201, pp. 320 - 328, http://dx.doi.org/10.1016/j.surfcoat.2005.11.121

Chan YH; Kim JK; Liu D; Liu PCK; Cheung YM; Ng MW, 2006, 'Comparative performance of gold wire bonding on rigid and flexible substrates', Journal of Materials Science Materials in Electronics, 17, pp. 597 - 606, http://dx.doi.org/10.1007/s10854-006-0005-4

Gao B; Kim JK; Leung CKY, 2006, 'Optimization of tapered end design for FRP strips bonded to RC beams', Composites Science and Technology, 66, pp. 1266 - 1273, http://dx.doi.org/10.1016/j.compscitech.2005.10.026

Sham ML; Kim JK, 2006, 'Surface functionalities of multi-wall carbon nanotubes after UV/Ozone and TETA treatments', Carbon, 44, pp. 768 - 777, http://dx.doi.org/10.1016/j.carbon.2005.09.013

Kim JK; Siddiqui NA; Woo RSC; Leung CCK; Munir A, 2006, 'Carbon fibre-organoclay hybrid epoxy composites: Fracture behaviours and mechanical properties', Key Engineering Materials, 312, pp. 179 - 184, http://dx.doi.org/10.4028/0-87849-994-6.179

Ding Y; Kim JK; Tong P, 2006, 'Effects of bonding force on contact pressure and frictional energy in wire bonding', Microelectronics Reliability, 46, pp. 1101 - 1112, http://dx.doi.org/10.1016/j.microrel.2005.09.010

Zhang TY; Kim JK, 2006, 'Mechanics of Materials: Preface', Mechanics of Materials, 38, pp. 1 - 2, http://dx.doi.org/10.1016/j.mechmat.2005.07.001

Kim J-K; Siddiqui NA; Woo RSC; Leung CCK; Munir A, 2006, 'Carbon fibre-organoclay hybrid epoxy composites: Fracture behaviours and mechanical properties', FRACTURE OF MATERIALS: MOVING FORWARDS, 312, pp. 179 - 184, http://dx.doi.org/10.4028/www.scientific.net/KEM.312.179

Chan YH; Kim JK; Liu D; Liu PCK; Cheung YM; Ng MW, 2005, 'Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding', IEEE Transactions on Advanced Packaging, 28, pp. 674 - 684, http://dx.doi.org/10.1109/TADVP.2005.853548

Kim JK; Lebbai M; Lam YM; Hung PYP; Woo RSC, 2005, 'Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide substrate', Journal of Adhesion Science and Technology, 19, pp. 427 - 444, http://dx.doi.org/10.1163/1568561054352568

Li J; Kim JK; Lung Sham M, 2005, 'Conductive graphite nanoplatelet/epoxy nanocomposites: Effects of exfoliation and UV/ozone treatment of graphite', Scripta Materialia, 53, pp. 235 - 240, http://dx.doi.org/10.1016/j.scriptamat.2005.03.034

Lai M; Kim JK, 2005, 'Effects of epoxy treatment of organoclay on structure, thermo-mechanical and transport properties of poly(ethylene terephthalate-co-ethylene naphthalate)/organoclay nanocomposites', Polymer, 46, pp. 4722 - 4734, http://dx.doi.org/10.1016/j.polymer.2005.03.062

Sham ML; Kim JK, 2005, 'Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages', Journal of Applied Polymer Science, 96, pp. 175 - 182, http://dx.doi.org/10.1002/app.21384

Kim JK; Sham ML; Sohn MS; Hu S, 2005, 'Effects of fibre surface treatment on dynamic tensile properties of glass woven fabric reinforced vinylester composites', Polymers and Polymer Composites, 13, pp. 453 - 466, http://dx.doi.org/10.1177/096739110501300503

Kim JK; Lebbai M; Woo RSC, 2005, 'Effects of hygrothermal ageing and thermal shock on reliability of interfacial adhesion between black oxide coated copper substrate and epoxy resin', Composite Interfaces, 12, pp. 739 - 756, http://dx.doi.org/10.1163/156855405774984020

Sham ML; Kim JK, 2005, 'Experiment and numerical analysis of the residual stresses in underfill resins for flip chip package applications', Journal of Electronic Packaging, 127, pp. 47 - 51, http://dx.doi.org/10.1115/1.1849232

Zhang TY; Kim JK, 2005, 'Guest editorial', Composites Science and Technology, 65, pp. 1325, http://dx.doi.org/10.1016/j.compscitech.2004.12.001

Kim JK; Hu C; Woo RSC; Sham ML, 2005, 'Moisture barrier characteristics of organoclay-epoxy nanocomposites', Composites Science and Technology, 65, pp. 805 - 813, http://dx.doi.org/10.1016/j.compscitech.2004.10.014

Gao B; Leung CKY; Kim JK, 2005, 'Prediction of concrete cover separation failure for RC beams strengthened with CFRP strips', Engineering Structures, 27, pp. 177 - 189, http://dx.doi.org/10.1016/j.engstruct.2004.09.007

Ding Y; Xue M; Kim JK, 2005, 'Thermo-structural analysis of space structures using Fourier tube elements', Computational Mechanics, 36, pp. 289 - 297, http://dx.doi.org/10.1007/s00466-005-0666-5

Gao B; Kim JK; Leung CKY, 2004, 'Experimental study on RC beams with FRP strips bonded with rubber modified resins', Composites Science and Technology, 64, pp. 2557 - 2564, http://dx.doi.org/10.1016/j.compscitech.2004.05.016

Hodzic A; Kim JK; Lowe AE; Stachurski ZH, 2004, 'The effects of water aging on the interphase region and interlaminar fracture toughness in polymer-glass composites', Composites Science and Technology, 64, pp. 2185 - 2195, http://dx.doi.org/10.1016/j.compscitech.2004.03.011

Lebbai M; Kim JK; Szeto WK; Wu J, 2004, 'Surface characterization and adhesion of black-oxide-coated copper substrate: Effect of surface hardening processes', Journal of Adhesion Science and Technology, 18, pp. 983 - 1001, http://dx.doi.org/10.1163/1568561041257513

Sham ML; Kim JK, 2004, 'Evolution of residual stresses in modified epoxy resins for electronic packaging applications', Composites Part A Applied Science and Manufacturing, 35, pp. 537 - 546, http://dx.doi.org/10.1016/j.compositesa.2004.01.002

Sham MLI; Kim JK, 2004, 'Improved underfill adhesion in flip-chip packages by means of ultraviolet light/ozone treatment', IEEE Transactions on Advanced Packaging, 27, pp. 179 - 187, http://dx.doi.org/10.1109/TADVP.2004.825452

Chan YH; Kim JK; Liu D; Liu PCK; Cheung YM; Ng MW, 2004, 'Process windows for low-temperature Au wire bonding', Journal of Electronic Materials, 33, pp. 146 - 155, http://dx.doi.org/10.1007/s11664-004-0285-5

Sham ML; Kim JK, 2003, 'Adhesion characteristics of underfill resins with flip chip package components', Journal of Adhesion Science and Technology, 17, pp. 1923 - 1944, http://dx.doi.org/10.1163/156856103770572052

Lebbai M; Kim JK; Szeto WK, 2003, 'Surface characteristics and adhesion performance of black oxide coated copper substrates with epoxy resins', Journal of Adhesion Science and Technology, 17, pp. 1543 - 1560, http://dx.doi.org/10.1163/156856103769207392

Kim JK; Hodzic A, 2003, 'Nanoscale characterisation of thickness and properties of interphase in polymer matrix composites', Journal of Adhesion, 79, pp. 383 - 414, http://dx.doi.org/10.1080/00218460309585

Kong JWY; Kim JK; Yuen MMF, 2003, 'Warpage in plastic packages: Effects of process conditions, geometry and materials', IEEE Transactions on Electronics Packaging Manufacturing, 26, pp. 245 - 252, http://dx.doi.org/10.1109/TEPM.2003.820806

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